Thanks to masters of teardowns at iFixit, we can see what Google and Samsung packed in Galaxy Nexus superphone.

Top side of Samsung Galaxy Nexus PCBs reveals three Samsung chips, MCU+NFC controller from NXP and Silicon Image's MHL transmitter

Top side of Samsung Galaxy Nexus PCBs reveals three Samsung chips, MCU+NFC controller from NXP and Silicon Image’s MHL transmitter

You can read the whole teardown here, but we were mostly interested in the chips Samsung used in creation of this sales hit. Unsurprisingly, we are seeing more and more Samsung chips being used in Samsung phones, which is an interesting change from other Galaxy phones, where Samsung chips were few and far between.

But if you take a look at the image below, you’ll see quite interesting components:

Upper PCB: Texas Instruments supplied 8-channel Audio and Power Management, Invensense Motion Processing unit, Bosch MEMS Pressure sensor and - Intel HSPA baseband modem
Upper PCB: Texas Instruments supplied 8-channel Audio and Power Management, Invensense Motion Processing unit, Bosch MEMS Pressure sensor and – Intel HSPA baseband modem

Maybe the most interesting part of this PCB was a foreign guest – usually, for HSPA connectivity Samsung relied on BroadCom chips, but for Galaxy Nexus, we’re seeing Intel XG626 baseband modem, which usually ships inside numerous 3G USB connectivity sticks, fighting against numerous models powered by Icera, Huawei, STMicro and many others.

All in all, Samsung made a lot of interesting innovations with this superphone and it will be interesting to see how the company will evolve its complicated designs.