The very first flexible imaging sensor is operational thanks to the efforts from Plastic Logic and ISORG. Though limited in operation given its 40x40mm size and mere resolution of 94×95 pixels, it opened up a range of possibilities for new applications.

ISORG and Plastic Logic collaborated on this project in order to make use of the technology both developed separately. ISORG?s tech enables the deposition of organic printed photodetectors (OPD) onto a plastic organic thin-film transistor (OTFT) that was developed by the Plastic Logic. OTFT is used since the tech offers a fantastic utilization range ? and in this instance, organic substrates allow for flexible surfaces. Both companies believe that this sensor has the potential to ?revolutionise weight/power trade-offs and optical design parameters for any systems with a digital imaging element.?

As noted earlier, this flexible sensor has a 40x40mm active area, 375um pitch (175um pixel size with 200um spacing) and a resolution of 94 x 95 pixels. Technologies combined to create this could offer new ways of implementing camera sensors in a wide range of products/parts: smart packaging, medical equipment, biomedical diagnostics, scanning surfaces and much, much more.

ISORG is a pioneer company in organic photodetectors, as well as imaging sensors in printed electronics, and their company?s CEO, Jean-Yves Gomez stated: ?We are extremely pleased to showcase our disruptive photodiode technology in a concrete application for imaging sensing. The ability to create conformal and large area image sensors, which are also thinner, lighter and more robust and portable than current equipment is of increasing importance, especially in the medical, industrial and security control sectors.? Indro Mukerjee, CEO of Plastic Logic added that he is delighted that their company is now able to demonstrate the vast potential of this technology, while their ability to create flexible transmissive backplanes continues to be a key for flexible displays as well.

First mechanical samples were publicly unveiled last week, during the Large-area Organic & Printed Electronics Convention (LOPE-C) in Munich, Germany.