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Sunday, March 21, 2010
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Comments
Think we'll ever dump ATX? by: General Lee D. Mented on 5/12/2009
What's that? TSMC not good enough? Can we say GT300 respin? ;)

There's a solution to the GPU heat problem: flip the MB and put it in the last slot. Then you can couple it directly to the top of the case for removing heat. Wonder why we haven't seen a proprietary (Shuttle?) design like this yet. Putting the CPU and north/southbridge on the back of the MB could use the case side in a similar fashion. Lots of cooling area, similar to water cooling in thermal capacity but no worries about liquids, pumps, and tubes.
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