At MWC 2011 in Barcelona many were eagerly awaiting to see what Qualcomm (QCOM
) would be announcing. As many expected, Qualcomm opted to give details regarding their Quad-Core mobile processors in order to counter-act the announcements made by their competitors; mainly Nvidia and Texas Instruments. Both competitors recently had information regarding Quad-Core processors announced and it was merely a matter of time until Qualcomm made a similar announcement or something was leaked. Qualcomm’s mobile strategy will heavily benefit from the advancements in process manufacturing nodes such as 28nm by TSMC which will be the new de-facto processing node for Qualcomm chipsets.
The newly named APQ8064
is Qualcomm’s latest and greatest mobile chipset. As you can imagine, the APQ8064 is Qualcomm’s quad-core processor that everyone has been awaiting. The APQ8064 is expected to be manufactured on the 28nm process node and as a result will be capable of running at higher clock speeds with a lower TDP and power consumption. The APQ8064 is the flagship processor of the new family of Snapdragon processors, and is based on the ‘Krait’ microarchitecture. This architecture enables the APQ8064 to run at a blazing 2.5GHz per core which will bring mobile processing capabilities to a mind boggling level. Even though the new APQ8064 is a quad-core capable of 2.5GHz per core, Qualcomm still expects the Krait architecture to yield power consumption 25% less than the first generation of Snapdragon processors.
Furthermore this will enable multi-screen phones with higher resolutions as well as HD gaming and stereoscopic 3D. These features would go along with the expected 1080P video output and multi-tasking that is already being seen with Qualcomm’s dual-core processors. On top of that, Qualcomm has beefed up the GPUs on their processors by including a Quad-Core Adreno 320 GPU which will deliver fifteen times better performance over the first generation Adreno GPU. This includes support for up to 20MP camera support which enables the ability for very high quality images or very high quality stereoscopic images be they still or moving and be able to play them back on screen or on a TV.
One of the other announcements made today included the release of mass market LTE and HSPA+ mobile broadband chipsets
which would enable muti-mode LTE and dual-carrier HSPA+. These advancements will be made possible by the MDM 9615 and MDM 8215 respectively. Qualcomm In addition to that, Qualcomm announced the support for HSPA+ release 9 which will enable data rates of up to 84 Mbps and will also utilize 28nm technology. This will be solely done by the MDM8225 chipset that is expected to support all major 3GPP radio bands, including the 1800MHz piece of spectrum.
On top of these announcements, Qualcomm also announced the commercial availability of Gobi3000 modules
enabling CDMA EV-DO Rev. A and Rev. B as well as HSPA+ of up-to 14.4 Mbps. Customers can expect to find Gobi3000 chips inside of business-class and consumer laptops from OEMs like Lenovo and Sony.
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