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HARDWARE
NEWS
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Thursday, September 20, GlobalFoundries announced a 14-nanometer (nm) XM PDK (eXtreme Mobility Process Development Kit) featuring FinFET three-dimensional transistors. Customer tape out is expected in early 2013.
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HARDWARE, BUSINESS
ANALYSIS
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Soitec announced a comprehensive product roadmap centered on fully depleted (FD) silicon technology. They are aiming for the magic 3-way combo: better performance, less power consumption, and cheaper manufacturing.
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HARDWARE, BUSINESS
NEWS
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As the completion of GlobalFoundries Fab 8 draws closer, we see that they are beginning to post job openings to fill for their new facility.
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HARDWARE
NEWS
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Silicon enabler Cadence Systems released a new toolset that lets chip manufacturers and designers engineer silicon products using an end-to-end design tools which shorten the time to build integrated chips.
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BUSINESS
NEWS
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IBM, Samsung and Global Foundries announced plans to use Gate-Last technology in 22 and 20nm manufacturing process, resulting in a lower manufacturing node without the need to redesign chips.
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GRAPHICS, BUSINESS
ANALYSIS
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Last week, ARM held their TechCon 2010 technology conference. They introduced a new Mali-T604 GPU IP and accompanying CoreLink 400 IP interconnect which provides high-speed cache sharing.
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