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Sunday, May 19, 2013
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GlobalFoundries Announces 14XM Process for 2014, to Challenge Intel
HARDWARE NEWS
Thursday, September 20, GlobalFoundries announced a 14-nanometer (nm) XM PDK (eXtreme Mobility Process Development Kit) featuring FinFET three-dimensional transistors. Customer tape out is expected in early 2013.
On 9/20/2012 by John Oram... Comments (0) Read more
Intel Captures WSJ Technology Innovation Award
HARDWARE NEWS
The Wall Street Journal passed out their Technology Innovation Awards. They stuck with known electronics brands, IBM, HP, Xerox and eInk for first place slots, Novartis for tracking medical supplies, and Abbott Labs.
On 10/18/2011 by Darleen Hartley... Comments (0) Read more

Intel 22nm Haswell Design Promises 10 Days of Standby Autonomy
HARDWARE NEWS
During Paul Otellini's keynote at IDF 2011, Intel's CEO mentioned that the company has completed work on the development of Haswell, it's next generation architecture - set for launch in 2013.
On 9/13/2011 by Theo Valich... Comments (0) Read more
Semiconductor Rumors: 14nm Node and 450mm Wafers by 2015
HARDWARE, BUSINESS NEWS, RUMORS
According to DigiTimes, quoting TSMC’s R&D boss Shang-yi Chiang, TSMC will begin volume production on 14nm in 2015. GlobalFoundries has similar plans, but you have to read between the lines.
On 9/11/2011 by John Oram... Comments (0) Read more

Intel Manufacturing Event in Munich: 22nm Breakthrough Analyzed
HARDWARE ANALYSIS
Recently, Intel held a 22nm Manufacturing Update event in Munich, Germany. The company proudly presented the new Tri-Gate (a.k.a. 3D) transistor which will be the base for building Ivy Bridge CPUs.
On 5/6/2011 by Marcus Pollice... Comments (0) Read more
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