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Saturday, May 18, 2013
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ARM Tapes-Out First Silicon based on TSMC’s 16nm FinFET Process Technology
HARDWARE, BUSINESS NEWS
When going against the company, most competitors attack process technology and claim they are better. Today, ARM and TSMC announced 64-bit silicon built on most advanced node TSMC has to offer.
On 4/2/2013 by Theo Valich... Comments (0) Read more
Intel CEO Paul Otellini to Retire in May 2013
ENTERPRISE, BUSINESS NEWS
Today Intel announced the retirement of Paul Otellini, who will leave Intel in May 2013, following his almost 40 years of service at the company.
On 11/19/2012 by Theo Valich... Comments (0) Read more

GlobalFoundries Announces 14XM Process for 2014, to Challenge Intel
HARDWARE NEWS
Thursday, September 20, GlobalFoundries announced a 14-nanometer (nm) XM PDK (eXtreme Mobility Process Development Kit) featuring FinFET three-dimensional transistors. Customer tape out is expected in early 2013.
On 9/20/2012 by John Oram... Comments (0) Read more
Soitec Announces Fully Depleted Silicon - Can it Bring SOI Back into the Game?
HARDWARE, BUSINESS ANALYSIS
Soitec announced a comprehensive product roadmap centered on fully depleted (FD) silicon technology. They are aiming for the magic 3-way combo: better performance, less power consumption, and cheaper manufacturing.
On 4/23/2012 by John Oram... Comments (0) Read more

Earnings Call Analysis: Intel all but Confirms Foundry Plans
HARDWARE, ENTERPRISE, BUSINESS ANALYSIS
Few days ago, we've posted the news on the Intel's earnings call for the first quarter of 2012. During the call Intel executives repeatedly said that some information will be held back until their Analyst Meeting in May.
On 4/23/2012 by Marcus Pollice... Comments (0) Read more
Exclusive: NVIDIA Tapes out Tegra at Samsung Fab, IBM, GlobalFoundries Next?
HARDWARE, BUSINESS RUMORS
At the Common Platform Technology Forum 2012, held today in Santa Clara, CA - we have confirmed our suspicions: Qualcomm and NVIDIA passed the point of impatience with TSMC.
On 3/14/2012 by Theo Valich... Comments (0) Read more

IBM, GlobalFoundries, Samsung to go FinFET, 3D Transistor with 14nm Process
HARDWARE NEWS
At the Common Platform Technology Forum 2012 held in Santa Clara, CA - Common Platform members announced their intention to switch from planar to 3D transistors by 2015.
On 3/14/2012 by Theo Valich... Comments (0) Read more
The Future of Intel CPU Architectures Revealed: Haswell, Skylake
HARDWARE, ENTERPRISE RUMORS, NEWS
In the next five years, Intel plans to launch no less than eight CPU architectures, keeping its annual cadence intact. We dug out some interesting information about the upcoming parts.
On 11/28/2011 by Theo Valich... Comments (0) Read more

Intel Captures WSJ Technology Innovation Award
HARDWARE NEWS
The Wall Street Journal passed out their Technology Innovation Awards. They stuck with known electronics brands, IBM, HP, Xerox and eInk for first place slots, Novartis for tracking medical supplies, and Abbott Labs.
On 10/18/2011 by Darleen Hartley... Comments (0) Read more

Intel 22nm Haswell Design Promises 10 Days of Standby Autonomy
HARDWARE NEWS
During Paul Otellini's keynote at IDF 2011, Intel's CEO mentioned that the company has completed work on the development of Haswell, it's next generation architecture - set for launch in 2013.
On 9/13/2011 by Theo Valich... Comments (0) Read more
Semiconductor Rumors: 14nm Node and 450mm Wafers by 2015
HARDWARE, BUSINESS NEWS, RUMORS
According to DigiTimes, quoting TSMC’s R&D boss Shang-yi Chiang, TSMC will begin volume production on 14nm in 2015. GlobalFoundries has similar plans, but you have to read between the lines.
On 9/11/2011 by John Oram... Comments (0) Read more

AMD Not Leaving SOI for 28nm 10-Core Macau and 20-Core Dublin CPUs?
HARDWARE NEWS
Following the GlobalFoundries Technology Conference, there is a lot of confusion on the status of SOI processing nodes before the arrival of Fully-Depleted Extra-Thin SOI with the 14nm process.
On 9/6/2011 by Theo Valich... Comments (0) Read more
ex-GlobalFoundries VP Jon Carvill to Lead Intel PR Smartphone Division
HARDWARE NEWS
GlobalFoundries recently lost their Head of Communications, Jon Carvill. As it usually happens with such departures, it was only a matter of time until a top tier company would offer a better package.
On 5/18/2011 by Theo Valich... Comments (0) Read more

Intel Manufacturing Event in Munich: 22nm Breakthrough Analyzed
HARDWARE ANALYSIS
Recently, Intel held a 22nm Manufacturing Update event in Munich, Germany. The company proudly presented the new Tri-Gate (a.k.a. 3D) transistor which will be the base for building Ivy Bridge CPUs.
On 5/6/2011 by Marcus Pollice... Comments (0) Read more
AMD Fusion Tapeouts Unveiled: 28nm in 2Q 2011, 20nm in 2012 and 14nm in 2014
GRAPHICS, HARDWARE NEWS
In the Q&A session of last weeks first quarter 2011 earnings call of AMD, the interim CEO Thomas Seifert made an interesting statement: "We expect several 28-nanometer tape-outs during the current quarter."
On 4/27/2011 by Marcus Pollice... Comments (0) Read more

Intel Building 14nm Chip Factory in Arizona Worth $5 Billion
HARDWARE, BUSINESS NEWS
The new state-of-the-art research and product development facility near Chandler, Arizona site will enable Intel to create transistors with a minimum feature size of 14 nanometers and hire more than 4,000 workers.
On 2/20/2011 by Christian Zibreg... Comments (0) Read more
Tech Demos Served With Music and Food: An Overview of Silicon Players That Matter
HARDWARE NEWS
At the Common Platform gathering, a bunch of firms that create tech which makes chips possible were vying for the attention of customers needing electronic device pieces, parts, and services.
On 2/3/2011 by Darleen Hartley... Comments (0) Read more

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