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HARDWARE, BUSINESS
NEWS
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When going against the company, most competitors attack process technology and claim they are better. Today, ARM and TSMC announced 64-bit silicon built on most advanced node TSMC has to offer.
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HARDWARE
NEWS
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At the 2013 Common Platform Technology Forum, the alliance members announced their new roadmap, accelerating the introduction of the new manufacturing processes in a bid to set the pace of the industry.
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HARDWARE
NEWS
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Today, Intel introduced their new 335 SSD series, which uses 20nm Intel NAND Flash, and is capable of 500 MB/s reads and 450 MB/s writes.
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HARDWARE
NEWS
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Thursday, September 20, GlobalFoundries announced a 14-nanometer (nm) XM PDK (eXtreme Mobility Process Development Kit) featuring FinFET three-dimensional transistors. Customer tape out is expected in early 2013.
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HARDWARE, BUSINESS
ANALYSIS
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During Computex Taipei 2012, we got an opportunity to talk with Jason Gorss and Subramani Kengeri, Head of the Advanced Technology Architecture at GlobalFoundries to discuss the latest news from the company.
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HARDWARE, BUSINESS
RUMORS
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At the Common Platform Technology Forum 2012, held today in Santa Clara, CA - we have confirmed our suspicions: Qualcomm and NVIDIA passed the point of impatience with TSMC.
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HARDWARE
NEWS
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At the Common Platform Technology Forum 2012 held in Santa Clara, CA - Common Platform members announced their intention to switch from planar to 3D transistors by 2015.
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HARDWARE, BUSINESS
NEWS
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DIGITAL ENTERTAINMENT
NEWS
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Nicholas Charbonnier, well known blogger from ARMdevices.net interviewed two industry veterans, our own contributing editor John Oram and Gil Russell, our principal analyst.
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HARDWARE, SOFTWARE, BUSINESS
NEWS
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ARM TechCon 2011 started off as a TSMC and Cadence show. The first day exhibit floor crowd seemed to be smaller than in years past. Last year, the event drew over 2,500 total attendees from 52 countries.
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HARDWARE, BUSINESS
NEWS
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HARDWARE, BUSINESS
NEWS
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On Wednesday, AMD announced preliminary third quarter results which significantly lowered the expectations for the third quarter ending on October 1st.
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HARDWARE, BUSINESS
NEWS, RUMORS
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According to DigiTimes, quoting TSMC’s R&D boss Shang-yi Chiang, TSMC will begin volume production on 14nm in 2015. GlobalFoundries has similar plans, but you have to read between the lines.
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HARDWARE, BUSINESS
NEWS
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HARDWARE
ANALYSIS
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Recently, Intel held a 22nm Manufacturing Update event in Munich, Germany. The company proudly presented the new Tri-Gate (a.k.a. 3D) transistor which will be the base for building Ivy Bridge CPUs.
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GRAPHICS, HARDWARE
NEWS
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In the Q&A session of last weeks first quarter 2011 earnings call of AMD, the interim CEO Thomas Seifert made an interesting statement: "We expect several 28-nanometer tape-outs during the current quarter."
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HARDWARE
RUMORS
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Watching movies for Easter is a family tradition. This time around, I got interrupted by a very interesting story coming out of South Korea.
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HARDWARE, BUSINESS
NEWS
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The seemingly headless AMD yesterday announced an amendment to their Wafer Supply Agreement (WSA) with GlobalFoundries. New deal shifts AMD from "per wafer" to "per good die", protecting it from bad yields.
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BUSINESS
NEWS
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IBM, Samsung and Global Foundries announced plans to use Gate-Last technology in 22 and 20nm manufacturing process, resulting in a lower manufacturing node without the need to redesign chips.
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ANALYSIS
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The nano sciences, unlike Mork's universe, are not science fiction. The smaller the better is the mantra in the chip industry.
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