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HARDWARE
NEWS
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At the 2013 Common Platform Technology Forum, the alliance members announced their new roadmap, accelerating the introduction of the new manufacturing processes in a bid to set the pace of the industry.
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HARDWARE
NEWS
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Thursday, September 20, GlobalFoundries announced a 14-nanometer (nm) XM PDK (eXtreme Mobility Process Development Kit) featuring FinFET three-dimensional transistors. Customer tape out is expected in early 2013.
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HARDWARE, BUSINESS
ANALYSIS
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Soitec announced a comprehensive product roadmap centered on fully depleted (FD) silicon technology. They are aiming for the magic 3-way combo: better performance, less power consumption, and cheaper manufacturing.
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HARDWARE, BUSINESS
RUMORS
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At the Common Platform Technology Forum 2012, held today in Santa Clara, CA - we have confirmed our suspicions: Qualcomm and NVIDIA passed the point of impatience with TSMC.
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HARDWARE
NEWS
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At the Common Platform Technology Forum 2012 held in Santa Clara, CA - Common Platform members announced their intention to switch from planar to 3D transistors by 2015.
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HARDWARE
NEWS
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Silicon enabler Cadence Systems released a new toolset that lets chip manufacturers and designers engineer silicon products using an end-to-end design tools which shorten the time to build integrated chips.
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HARDWARE, BUSINESS
NEWS
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The Common Platform is comprised of companies that collaborate to bring us tomorrow. Here's a look at some of the movers and shakers which were at the Common Platform Forum held earlier this month.
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BUSINESS
NEWS
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IBM, Samsung and Global Foundries announced plans to use Gate-Last technology in 22 and 20nm manufacturing process, resulting in a lower manufacturing node without the need to redesign chips.
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ANALYSIS
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The nano sciences, unlike Mork's universe, are not science fiction. The smaller the better is the mantra in the chip industry.
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HARDWARE, SOFTWARE
NEWS
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Synopsys reduces the need to create a 28nm design from scratch. You could equate their Lynx Design System to a Betty Crocker Cake Mix, all the key ingredients are in the box. You just add milk and eggs.
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HARDWARE, BUSINESS
NEWS
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As the industry adopts 32/28nm semiconductor manufacturing technology, the Common Platform development teams aren’t letting grass grow under their feet.
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GRAPHICS, BUSINESS
ANALYSIS
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Last week, ARM held their TechCon 2010 technology conference. They introduced a new Mali-T604 GPU IP and accompanying CoreLink 400 IP interconnect which provides high-speed cache sharing.
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HARDWARE
NEWS
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ARM Techcon3 in Santa Clara The conference opened with nearly two hour session about optimizing the ARM IP for next-generation, 32/28LP [low power] mobile SoC designs.
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