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HARDWARE, BUSINESS
NEWS
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HARDWARE, BUSINESS
RUMORS
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At the Common Platform Technology Forum 2012, held today in Santa Clara, CA - we have confirmed our suspicions: Qualcomm and NVIDIA passed the point of impatience with TSMC.
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HARDWARE
NEWS
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At the Common Platform Technology Forum 2012 held in Santa Clara, CA - Common Platform members announced their intention to switch from planar to 3D transistors by 2015.
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HARDWARE, ENTERPRISE
ANALYSIS
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On Tuesday, Intel invited a select group of journalists to the announcement of their new Xeon processor E5-2600 product family.
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HARDWARE, BUSINESS
NEWS
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We have just received information that GlobalFoundries initiated revenue production of customer silicon at their Fab 8 facility in Malta, New York. First chips are 32nm SOI for IBM.
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HARDWARE, BUSINESS
NEWS
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HARDWARE
NEWS
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The Wall Street Journal passed out their Technology Innovation Awards. They stuck with known electronics brands, IBM, HP, Xerox and eInk for first place slots, Novartis for tracking medical supplies, and Abbott Labs.
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HARDWARE
ANALYSIS
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Recently, Intel held a 22nm Manufacturing Update event in Munich, Germany. The company proudly presented the new Tri-Gate (a.k.a. 3D) transistor which will be the base for building Ivy Bridge CPUs.
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HARDWARE, SOFTWARE
NEWS
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Synopsys reduces the need to create a 28nm design from scratch. You could equate their Lynx Design System to a Betty Crocker Cake Mix, all the key ingredients are in the box. You just add milk and eggs.
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GRAPHICS, BUSINESS
ANALYSIS
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Last week, ARM held their TechCon 2010 technology conference. They introduced a new Mali-T604 GPU IP and accompanying CoreLink 400 IP interconnect which provides high-speed cache sharing.
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HARDWARE, BUSINESS
NEWS
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Less than ten months ago, Jim Ballingall, sat with BSN* and showed their plans to build an ARM Cortex-A9 on a 28nm node. There were only three of us in the room as Ballingall went through a step-by-step process to reach that goal.
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HARDWARE, BUSINESS
NEWS
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HARDWARE, BUSINESS
ANALYSIS
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AMD Financial Analyst Day 2009 GlobalFoundries showed they were serious about ARM at TechCon3. On Wednesday, Doug Grose, CEO of GlobalFoundries, and Bruce McDougall, CFO, gave an update on their progress.
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HARDWARE
NEWS
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ARM Techcon3 in Santa Clara The conference opened with nearly two hour session about optimizing the ARM IP for next-generation, 32/28LP [low power] mobile SoC designs.
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HARDWARE
NEWS
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ARM is moving forward with its plans to work with GlobalFoundries on their new generation of 40nm SoC chips. Should Intel and NVIDIA be afraid?
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HARDWARE
NEWS
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GlobalFoundries announced that the company reached a double-digit yield with 24Mbit SRAM chips in their 32nm process, on track for 50% yield by year's end.
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HARDWARE, BUSINESS
NEWS
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The chilling prospect of nVidia adding GlobalFoundries to their foundry mix and decreasing TSMC's share caused TSMC to re-focus and pushes the 28nm process forward.
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BUSINESS
ANALYSIS
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There are lots of behind the scene maneuvers by Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) to maintain their top ranked status in the fab world. The threat of GlobalFoundries is above their heads...
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HARDWARE, BUSINESS
INTERVIEWS
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GlobalFoundries is the new player on the foundry market - we decided to dig down deep and find out how they differ from current foundries? We interview Tom Sonderman, VP of Manufacturing Systems.
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